What Causes Xbox 360’s Red Ring of Death?

Red Ring of Death can be caused by many reasons, the main reason stems from the poor design and heat that is applied to the gpu and motherboard over long periods of time. Causing hardware failure and the 3 red rigs.

What are the other reasons for Xbox 360’s Red Ring of Death?

The Lead free solder
The Xbox 360 solder is very brittle.
To avoid using lead in their products Microsoft made the Xbox 360 with lead free solders. Lead free solders are more brittle. They also used the wrong type of lead free solder, one that gets destroyed with heat exposure over long periods of time. If used for long periods of time, tiny hair-line cracks will develop on the solder. The cracks obstruct the flow of electrical current and  result in a weaker solder joint that easily breaks.
Bad Heat Sink Clamp Design
The Xbox 360 heatsink design causes the motherboard to bend.
The  uneven pressure from the X clamps,  intensifies when the GPU and CPU gets overheated, causing the motherboard to bend and become warped.  Lead free solder joints then get stressed when the motherboard bends.

Left over foil on the heat sink
On a select few units, Microsoft forgot to remove foil on the heat sink!. Several “red ring of death” failures have happened because of this. The thermal compound will need to be reapplied if you attempt to remove this foil.
Deficient Manufacturing Process: Soldering Temperature Was Too Low
The Soldering process was done at to low of a temperature, and because of this the lead free solders can’t work properly. This alone is a problem. Not including when you get a warped motherboard and overheating from poor airflow in the system.
The Graphics Chip Gives off to much heat.
Microsoft created the graphic chips themselves, and decided not to use an experienced vendor. And because of this, the graphics chip is not optimal for the system, and overheats.